Additionalinformation

Additional Information

• Flat hierarchies, direct communication, and a backbone of integrity, courage, responsibility.
• A fast-moving environment where momentum is not lost in approval loops.
• Collaborate with colleagues and customers across countries, industries, and perspectives.
• A workplace shaped by technology, curiosity, and continuous improvement.
• Challenges with scale, depth, and enough complexity to keep you learning.

Companydescription

Company Description

Variosystems develops and manufactures electronic solutions for industries where reliability is critical - including Medtech & Life Science, Industrial & Automation, Aerospace & Defence and Smart Infrastructure & Environment. As a long-term strategic partner to innovators and market leaders, we offer services along the entire value chain, from concept and engineering to validated assemblies and global production. Across our global network, more than 2,800 people work together to transform ideas into reliable electronic systems.

Jobdescription

Job Description

• Develop and understand concept and architecture level diagrams.
• Circuit design and Schematic capture.
• Define stack-up and own PCB layout design.
• Board bring-up, testing and characterization, and debug.
• Power and signal integrity analysis.
• Lead technical discussions with customer engineering teams.

Qualifications

• Bachelor's degree in Electronics Engineering.
• 3+ years of professional experience designing mixed signal electronics and multi-layer PCBs.
• Knowledge in HDI design principals.
• Solid understanding of circuit design fundamentals: power supplies, signal integrity, sensor interfacing, and communication protocols (I2C, SPI, UART, CAN).
• Experience in bringing up and debugging hardware using lab equipment (oscilloscopes, multimeters, logic analyzers, power supplies).
• Ability to read and produce clear technical documentation, including schematics, BOMs.
• Strong collaboration and communication skills.

Preferred Qualifications

• Master's degree in Electronics Engineering.
• Prior experience with high speed board design (PCIe/DDR3 implementation).
• Experience in RF design projects.
• Experience with industrial-grade product design, including EMI/EMC considerations.
• Experience in embedded firmware (C/C++) development.
• Familiarity with relevant compliance and safety standards (e.g., UL, CE, FCC, IEC 61010).